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  ? semiconductor components industries, llc, 2011 november, 2011 ? rev. 9 1 publication order number: m1ma141wkt1/d m1ma141wkt1g, m1ma142wkt1g, sm1ma142wkt1g, common cathode silicon dual switching diode this common cathode silicon epitaxial planar dual diode is designed for use in ultra high speed switching applications. this device is housed in the sc ? 70 package which is designed for low power surface mount applications. features ? fast t rr , < 3.0 ns ? low c d , < 2.0 pf ? aec ? q101 qualified and ppap capable ? s prefix for automotive and other applications requiring unique site and control change requirements ? these devices are pb ? free, halogen free/bfr free and are rohs compliant* maximum ratings (t a = 25 ? c) rating symbol value unit reverse voltage m1ma141wkt1g m1ma142wkt1g, sm1ma142wkt1g v r 40 80 vdc peak reverse voltage m1ma141wkt1g m1ma142wkt1g, sm1ma142wkt1g v rm 40 80 vdc forward current single dual i f 100 150 madc peak forward current single dual i fm 225 340 madc peak forward surge current m1ma141wkt1g m1ma142wkt1g, sm1ma142wkt1g i fsm (note 1) 500 750 madc thermal characteristics rating symbol max unit power dissipation p d 150 mw junction temperature t j 150 ? c storage temperature t stg ? 55 to + 150 ? c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. t = 1 sec *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. http://onsemi.com sc ? 70 (sot ? 323) case 419 style 5 marking diagram mx = device code x = t for 141 u for 142 m = date code*  =pb ? free package cathode 3 12 anode device package shipping ? ordering information ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. mx m   m1ma142wkt1g sc ? 70 (pb ? free) 3,000 / tape & reel m1ma141wkt1g sc ? 70 (pb ? free) 3,000 / tape & reel (note: microdot may be in either location) *date code orientation may vary depending upon manufacturing location. sm1ma142wkt1g sc ? 70 (pb ? free) 3,000 / tape & reel
m1ma141wkt1g, m1ma142wkt1g, sm1ma142wkt1g, http://onsemi.com 2 electrical characteristics (t a = 25 ? c) characteristic condition symbol min max unit reverse voltage leakage current m1ma141wkt1g m1ma142wkt1g, sm1ma142wkt1g v r = 35 v v r = 75 v i r ? ? 0.1 0.1  adc forward voltage i f = 100 ma v f ? 1.2 vdc reverse breakdown voltage m1ma141wkt1g m1ma142wkt1g, sm1ma142wkt1g i r = 100  a v r 40 80 ? ? vdc diode capacitance v r = 0, f = 1.0 mhz c d ? 2.0 pf reverse recovery time (figure 1) i f = 10 ma, v r = 6.0 v, r l = 100  , i rr = 0.1 i r t rr (note 2) ? 3.0 ns 2. t rr test circuit
m1ma141wkt1g, m1ma142wkt1g, sm1ma142wkt1g, http://onsemi.com 3 a r l t r t p t 10% 90% v r t p = 2  s t r = 0.35 ns i f t rr t i rr = 0.1 i r i f = 10 ma v r = 6 v r l = 100  recovery time equivalent test circuit input pulse output pulse figure 1. recovery time equivalent test circuit 100 0.2 0.4 v f , forward voltage (volts) 0.6 0.8 1.0 1.2 10 1.0 0.1 t a = 85 ? c 10 0 v r , reverse voltage (volts) 1.0 0.1 0.01 0.001 10 20 30 40 50 0.68 0 v r , reverse voltage (volts) 0.64 0.6 0.56 0.52 c d , diode capacitance (pf) 2468 i f , forward current (ma) figure 2. forward voltage figure 3. reverse current figure 4. diode capacitance t a = -40 ? c t a = 25 ? c t a = 150 ? c t a = 125 ? c t a = 85 ? c t a = 55 ? c t a = 25 ? c i r , reverse current ( ? a)
m1ma141wkt1g, m1ma142wkt1g, sm1ma142wkt1g, http://onsemi.com 4 package dimensions sc ? 70 (sot ? 323) case 419 ? 04 issue n a a2 d e1 b e e a1 c l 3 12 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 0.05 (0.002) 1.9 0.075 0.65 0.025 0.65 0.025 0.9 0.035 0.7 0.028  mm inches  scale 10:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e dim a min nom max min millimeters 0.80 0.90 1.00 0.032 inches a1 0.00 0.05 0.10 0.000 a2 0.70 ref b 0.30 0.35 0.40 0.012 c 0.10 0.18 0.25 0.004 d 1.80 2.10 2.20 0.071 e 1.15 1.24 1.35 0.045 e 1.20 1.30 1.40 0.047 0.035 0.040 0.002 0.004 0.014 0.016 0.007 0.010 0.083 0.087 0.049 0.053 0.051 0.055 nom max l 2.00 2.10 2.40 0.079 0.083 0.095 h e e1 0.65 bsc 0.38 0.028 ref 0.026 bsc 0.015 0.20 0.56 0.008 0.022 style 5: pin 1. anode 2. anode 3. cathode on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 m1ma141wkt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative


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